000			00814nam a2200217 4500
001			0000008331
008			231118s9999 xx 000 0 und d
020	0	0	_a0471594466
040			_aPJB
090	0	0	_aTK7870.15 _b.P42 1994
090	0	0	_aTK7870.15 _bP42 1994
245	0	0	_aIntegrated circuit, hybrid, and multichip module package design guidelines _ba focus on reliability _c[edited by] Michael Pecht
260			_aNew York _bWiley _cc1994
300			_axxxi, 426 p. _bill. _c25 cm.
500			_a"A Wiley-Interscience publication."
504			_aElectronic packaging _xDesign
504			_aIncludes bibliographical references and index.
650		0	_aHybrid integrated circuits _xDesign and construction
650		0	_aMultichip modules (Microelectronics) _xDesign and construction
700	1		_aPecht, Michael
999			_c117256 _d117256