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Optoelectronic packaging edited by Alan R. Mickelson, Nagesh R. Basavanhally and Yung-Cheng Lee by
  • Basavanhally, Nagesh R
  • Lee, Yung-Cheng
  • Mickelson, Alan R
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York John Wiley & Sons 1997
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK IBRAHIM SULTAN (2)Call number: TA1750 .O68 1997, ...

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Multichip module technology handbook Philip E. Garrou, Iwona Turlik. by
  • Garrou, Philip E
  • Turlik, Iwona
Series: Electronic packaging and interconnection series
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York McGraw-Hill 1998
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK IBRAHIM SULTAN (1)Call number: TK7874. G372 1998.

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