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		Printed circuit board materials handbook Martin W. Jawitz, editor in chief. by Jawitz, Martin W Series: Electronic packaging and interconnection series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York McGraw-Hill 1997 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK IBRAHIM SULTAN (2)Call number: TK7868.P7. P723 1997, ... Place hold Add to cart (remove)
		Thermal management handbook for electronic assemblies Jerry Sergent, Al Krum. by Sergent, Jerry E Krum, Al Series: Electronic packaging and interconnection series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York McGraw-Hill 1998 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK IBRAHIM SULTAN (1)Call number: TK7870.25 . S47 1998 handbook. Place hold Add to cart (remove)
		Multichip module technology handbook Philip E. Garrou, Iwona Turlik. by Garrou, Philip E Turlik, Iwona Series: Electronic packaging and interconnection series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York McGraw-Hill 1998 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK IBRAHIM SULTAN (1)Call number: TK7874. G372 1998. Place hold Add to cart (remove)

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