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Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability [edited by] Michael Pecht by
  • Pecht, Michael
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York Wiley c1994
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK IBRAHIM SULTAN (1)Call number: TK7870.15 .P42 1994.

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Strategies to the prediction, mitigation, and management of product obsolescence Bjoern Bartels ...[et.al.] by
  • Bartels
  • Ermel
  • Pecht
  • Sandborn, Peter
Series: Wiley series in Systems Engineering and management
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New Jersey John Wiley & sons c2012
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK IBRAHIM SULTAN (1)Call number: TK7881 .S905 2012.

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