TY  - BOOK
AU  - Pecht,Michael
TI  - Integrated circuit, hybrid, and multichip module package design guidelines: a focus on reliability
SN  - 0471594466
PY  - 1994///
CY  - New York
PB  - Wiley
KW  - Hybrid integrated circuits
KW  - Design and construction
KW  - Multichip modules (Microelectronics)
N1  - "A Wiley-Interscience publication."; Electronic packaging; Includes bibliographical references and index
ER  -