Integrated circuit, hybrid, and multichip module package design guidelines  a focus on reliability 
[edited by] Michael Pecht 
 - New York  Wiley  c1994 
 - xxxi, 426 p.  ill.  25 cm. 
<br/><br/> "A Wiley-Interscience publication." 
<br/><br/>Electronic packaging Includes bibliographical references and index. 
<br/><br/><label>ISBN: </label>0471594466 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Hybrid integrated circuits--Design and construction<br/>Multichip modules (Microelectronics)--Design and construction