TY  - BOOK
AU  - Lau,John H.
TI  - Flip chip technologies
SN  - 0070366098
PY  - 1996///
CY  - Boston, Mass.
PB  - McGraw-Hill
KW  - Flip chip technology
KW  - Integrated circuits
KW  - Very large scale integration
KW  - Design and construction
KW  - Multichip modules (Microelectronics)
N1  - Includes bibliographical references and index
ER  -