Flip chip technologies 
John H. Lau, editor. 
 - Boston, Mass.  McGraw-Hill  1996. 
 - xxiv, 565 p.  ill.  24cm. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/><label>ISBN: </label>0070366098 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Flip chip technology.<br/>Integrated circuits--Very large scale integration--Design and construction.<br/>Multichip modules (Microelectronics)--Design and construction.